EH9721贴片机拥有轨道接驳上下料等功能，应用产品更广泛，更适用于批量化的产品生产。
产品特点：
1.高精度：±2µm@3σ
2.高效率：多工作台、快速精准温控及力控
3.高柔性：多吸嘴自动更换、多中转工位自由切换、多种上料方式灵活选配、轨道接驳上下料
4.易扩展：配合客户进行工艺探索、可定制开发、功能模块可选配FlipChip
产品型号 | EH9721 | |
Product model | EH9721 | |
贴装精度 | ±2µm@3σ | |
Placement Accuracy | ±2µm@3σ | |
贴装角度 | ±0.3° | |
Placement Angle | ±0.3° | |
贴装工艺 | 共晶、蘸胶、FlipChip（选配） | |
Placement Process | Eutectic, Underfill, Flip Chip (optional) | |
设备应用 | COC,COB,GoldBox,Cow,Cos | |
Equipment Application | COC,COB,Gold Box,Cow,Cos | |
效率 | 15~25s/pcs（共晶， 依据具体应用） | |
5~7s/pcs（蘸胶， 依据具体应用） | ||
Efficiency | 15~25 seconds per piece (Eutectic, depending on actualworking conditions) | |
5~7 seconds per piece (Underfill, depending on actualworking conditions) | ||
贴装模块 | 吸嘴 | 单头12个，动态换刀 |
Nozzle | 12 nozzles per single head, dynamic tool change | |
力控 | （10g-50g)±2g； （50g-300g)±3% | |
Surface Mount Technology (SMT) module | Force Control | （10g-50g)±2g； （50g-300g)±3% |
移栽模块 | 吸嘴 | / |
Nozzle | ||
力控 | / | |
Transfer Module | Force Control | |
共晶模块 | 工作台 | 1 |
Workbench | 1 | |
中转台 | 单工作台8个（Zui多） | |
Transfer Station | 8 (maximum) on a single workbench | |
加热方式 | 脉冲加热 | |
Heating Method | Pulse Heating | |
温度范围 | 500°C（Zui高） | |
Temperature Range | Up to 500°C (maximum) | |
温升速率 | 50°C/S(Zui大) | |
Eutectic Module | Temperature Ramp Rate | Up to 50°C/s (maximum) |
供料模式 | Wafer,Waffle Pack,Gel-Pak | Wafer，6吋，Zui多支持2个 |
Wafer, 6 inches, supports up to 2 pieces | ||
Waffle Pack, Gel-Pak，2吋，Zui多支持9个 | ||
Waffle Pack, Gel-Pak, 2 inches, supports up to9 pieces | ||
轨道接驳上下料（选配） | ||
Feeding Mode | Wafer,Waffle Pack, Gel-Pak | Track Connection Loading and Unloading (optional) |
外形尺寸（长×宽×高） | 1650mm×1100mm×1800mm | |
Overall Dimension (Length x Width x Height) | 1650mm×1100mm×1800mm | |
重量 | 2200Kg（Zui大） | |
Weight | 2200Kg (maximum) | |
压缩空气 | 0.4~0.7MPa | |
Compressed Air | 0.4~0.7MPa | |
氮气 | 0.4~0.7MPa | |
Nitrogen | 0.4~0.7MPa | |
环境温度 | 23±2°C | |
Ambient Temperature | 23±2°C | |
